Aug 19 | Articles
A recent engineering design challenge asked FPGA experts to design a “Logic Analyzer in a Day” using off-the-shelf Opal Kelly FPGA-USB modules and its Front Panel SDK. The objective was to showcase the design capabilities of these engineering experts...
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Aug 19 | Articles
When HDMI version 1.4 was publicly released in October 2009, it included a number of new features. Most of the new features are barely moving the needle on the consumer electronics industry's Richter scale. But one new HDMI 1.4 feature -- the implementation of 3D video mode -- is about to buckle the pavement of the status quo.
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Aug 4 | Articles
Characterizing devices at low current levels requires knowledge, skill, and the right test equipment. Even with all three, achieving accuracy at low current levels can be a challenge because the level of the current is often at or below the noise level of the test setup. To ensure success in low-level current measurements, it is important to know the type of test equipment to use, the different sources of measurement error, and the appropriate techniques to minimize these errors.
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Jul 21 | Articles
“Global Warming, Carbon Footprint, and Energy Efficiency” are becoming mantras for the industrial manufacturing sector. With energy costs constantly rising leading to increased overhead costs, the need to use electrical energy in a more efficient manner by reducing the amount is at the fundamental basis of this crisis.
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Jul 21 | Articles
A growing number of applications require linear motion sensing, including X-Y tooling tables, pneumatic pistons, automatic sliding doors and zoom lenses. One commonly used technique involves resistive strips (potentiometers). While this approach is simple and inexpensive, it depends on mechanical contacts so it is prone to wearing out.
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Jul 21 | Articles
Gyroscopes are often used for inertial navigation or other applications where high accuracy or stability is required. To maximize performance, the gyros used in these applications are generally calibrated and externally temperature compensated. This article outlines a method for performing calibration and temperature compensation.
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Jun 24 | Articles
A continuing trend among OEM’s and design engineers has been increased reliance upon mechanical impact testing of product prototypes and packaging, as a means of simulating the ruggedness, durability and performance of materials and structures within their intended usage environment.
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Jun 24 | Articles
The ability to monitor product inventory has always been a primary concern for companies. When the product is not a fixed, physical unit of measure, but a volume of liquid; the challenge increases. The evolvement of wireless technology presents an exciting opportunity for remote monitoring.
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Jun 22 | Articles
The 2010 Sensors Expo & Conference was held June 7-9 in Rosemont, IL. Rain put a damper on things outside the Donald Stevens Convention Center on Tuesday. But inside, the sun, wind, and all manner of alternative energy sources were on the minds of attendees as products based on energy harvesting continued to play a prominent role at the show.
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Jun 22 | Blogs
Some of the avoidable stress factors effecting semiconductor reliability have led many fabricators to choose fused quartz as the material of choice for semiconductor wafer processing as well as laboratory and testing applications.
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